Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Device packages with low stress assembly process

Device packages with low stress assembly process

US Patent 7164199 · Granted Jan 16, 2007

Estimated economic value: $14,105,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Micromirror array assembly2016
Microelectromechanical device packages with integral heaters2015
Low cost hermetically sealed package2014
Micromirror array assembly with in-array pillars2014
Microelectromechanical device packages with integral heaters2011
Micromirror array assembly with in-array pillars2010
Low cost hermetically sealed package2009
Microelectromechanical device packages with integral heaters2008
Micromirror array device with compliant adhesive2008
Packaging method for microstructure and semiconductor devices2008
Microelectromechanical device packages with integral heaters2007
Electrical contacts in microelectromechanical devices with multiple substrates2006