Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Component formation via plating technology

Component formation via plating technology

US Patent 7161794 · Granted Jan 9, 2007

Estimated economic value: $16,802,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Ultracapacitor for use in a solder reflow process2023
Low noise capacitors2023
Plated terminations2021
Plated terminations2021
Plated terminations2021
Plated terminations2021
Discrete cofired feedthrough filter for medical implanted devices2021
High capacitance tunable multilayer capacitor and array2021
Low noise capacitors2021
Voltage tunable multilayer capacitor2021
High voltage tunable multilayer capacitor2020
Ultracapacitor for use at high temperatures2020