Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Use of thermoplastic polyamide molding compositions with reduced formation of solid deposits and/or coverings

Use of thermoplastic polyamide molding compositions with reduced formation of solid deposits and/or coverings

US Patent 7151127 · Granted Dec 19, 2006

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Method of manufacturing a mold that is resistant to hypochlorite2025
Polyamide molding compound with low dielectric loss factor2024
Polyamide molding compounds for hypochlorite-resistant applications2024
Polyamide moulding composition, in particular for the production of mouldings in2021
Method and container for storage and transport of polyamide granulates and corre2021
Transparent polyamide moulding compositions with high tensile strain at break2020
High temperature-resistant polyamide moulding compounds and uses thereof especia2019
Plastic molding compound and use thereof2019
Copolyamides, moulding compounds comprising these and moulded articles produced 2018
Polyamide molding material and moldings manufactured from same2018
Polyamide moulding compositions, process for production thereof and use of these2018
Filler materials having surface coating made from water soluble polyamides2017