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Home › Holding device, in particular for fixing a semiconductor wafer in a plasma etching device, and method for supplying heat to or dissipating heat from a substrate

Holding device, in particular for fixing a semiconductor wafer in a plasma etching device, and method for supplying heat to or dissipating heat from a substrate

US Patent 7149070 · Granted Dec 12, 2006

Estimated economic value: $3,139,000 ⓘ

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