Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method for packaging integrated circuit chips

Method for packaging integrated circuit chips

US Patent 7135779 · Granted Nov 14, 2006

Estimated economic value: $15,893,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Non-orthogonal additive manufacturing and the treatment of parts manufactured th2025
Reinforced medical balloon2025
Simplified coaxial shaft design delivery system and implant for mitral valve ann2025
System and method for qualifying collected data2025
Guide extension catheter2025
Occlusive medical device2025
Predisposed annulus patch for valve repair implant2024
Left atrial appendage implant with continuous covering2024
Introducer with expandable capabilities2024
Occlusive device with expandable member2024
Occlusive device with actuatable fixation members2024
Simplified coaxial shaft design delivery system and implant for mitral valve ann2023