Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Support layer for thin copper foil

Support layer for thin copper foil

US Patent 7132158 · Granted Nov 7, 2006

Estimated economic value: $5,609,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Fretting and whisker resistant coating system and method2010
Peel strength enhancement of copper laminates2010
Peel strength enhancement of copper laminates2010
Method for manufacturing a composite material including copper foil and support 2010
Method for manufacturing a composite material including copper foil and support 2010
Fretting and whisker resistant coating system and method2008
Tarnish deterring tin coating2005
Copper foil with low profile bond enhancement2005
Copper foil with low profile bond enhancement2005
Chromium-free antitarnish adhesion promoting treatment composition2005
Bond enhancement antitarnish coatings2005
Copper foil composite including a release layer2004