Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Plasma etch process for multilayer vias having an organic layer with vertical sidewalls

Plasma etch process for multilayer vias having an organic layer with vertical sidewalls

US Patent 7125796 · Granted Oct 24, 2006

Estimated economic value: $38,657,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Memory-module extender card for visually decoding addresses from diagnostic prog2014
Managing and indentifying multiple memory storage devices2014
Memory-module extender card for visually decoding addresses from diagnostic prog2013
Ultra-thin die and method of fabricating same2012
Ultra-thin die and method of fabricating same2012
Wireless flash memory card expansion system2012
Method for high volume manufacturing of thin film batteries2012
Ultra-thin die and method of fabricating same2009
Ultra-thin die and method of fabricating same2009
Lithographic template and method of formation and use2008
Lithographic template and method of formation and use2008
Plasma etch process for defining catalyst pads on nanoemissive displays2008