Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Semiconductor device assemblies including interposers with dams protruding therefrom

Semiconductor device assemblies including interposers with dams protruding therefrom

US Patent 7115981 · Granted Oct 3, 2006

Estimated economic value: $1,273,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Microelectronic device wafers and methods of manufacturing2013
Microelectronic device wafers and methods of manufacturing2011
Thin flip-chip method2010
Reinforced, self-aligning conductive structures for semiconductor device compone2009
Thin flip-chip method2007
Methods for fabricating stiffeners for flexible substrates2007
Support ring for use with a contact pad and semiconductor device components incl2007
Thick solder mask for confining encapsulant material over selected locations of 2006
Method and stencil for extruding material on a substrate2006
Methods of encapsulating selected locations of a semiconductor die assembly usin2006
Microelectronic devices and methods for mounting microelectronic packages to cir2006
Methods for providing support for conductive structures protruding from semicond2006