Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Integrated circuit package substrate having a thin film capacitor structure

Integrated circuit package substrate having a thin film capacitor structure

US Patent 7099139 · Granted Aug 29, 2006

Estimated economic value: $13,270,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Integrated passive devices on chip2019
Magnetic nanocomposite materials and passive components formed therewith2018
Method of forming a substrate core with embedded capacitor and structures formed2017
Energy storage devices formed with porous silicon2016
Method apparatus and material for radio frequency passives and antennas2016
Conductive silver paste for a metal-wrap-through silicon solar cell2016
Magnetic microinductors for integrated circuit packaging2014
Sol-gel and mask patterning for thin-film capacitor fabrication, thin-film capac2014
Methods of making thin film capacitors2013
Ceramic package substrate with recessed device2012
Split thin film capacitor for multiple voltages2011
Split thin film capacitor for multiple voltages2011