Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Ball assignment schemes for integrated circuit packages

Ball assignment schemes for integrated circuit packages

US Patent 7095107 · Granted Aug 22, 2006

Estimated economic value: $3,850,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Integrated antennas on side wall of 3D stacked die2025
Cantilevered power planes to provide a return current path for high-speed signal2025
Photonics integration in semiconductor packages2024
Object of interest tracking2022
Extraction of problem diagnostic knowledge from test cases2021
Portable load testing device2021
Just-in-time data migration in a live system2021
Hexagonally arranged connection patterns for high-density device packaging2021
Policy based dynamic data collection for problem analysis2020
Policy based dynamic data collection for problem analysis2020
Extraction of problem diagnostic knowledge from test cases2019
Extraction of problem diagnostic knowledge from test cases2019