Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Interconnect for electrically connecting a multichip module to a circuit substrate and processes for making and using same

Interconnect for electrically connecting a multichip module to a circuit substrate and processes for making and using same

US Patent 7073253 · Granted Jul 11, 2006

Estimated economic value: $29,324,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Triangular fibrocartilage complex reconstruction techniques2022
Joint kinematic reconstruction techniques2022
Techniques for indexing and querying a set of documents at a computing device2022
Takedown pin and tool-less pivot pin for firearms2022
Joint kinematic reconstruction techniques2021
Joint kinematic reconstruction techniques2020
Joint kinematic reconstruction techniques2019
Bicyclic methylene aziridines and reactions thereof2017
Quality test device for inspecting vehicular display module having thin-film tra2017
Bicyclic methylene aziridines and reactions thereof2015
Adjustment drive for adjusting the string tension of a stringed instrument2014
Tuning peg for a stringed instrument2014