Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › High density multi-lead surface mount interconnect and devices including same

High density multi-lead surface mount interconnect and devices including same

US Patent 7059867 · Granted Jun 13, 2006

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

System and method to improve standby efficiency of LLC converter2018
System and method to improve standby efficiency of LLC converter2017
Composition for forming controlled tin-lead solder alloy composition1995
Golf club1988