Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Formation method for conductive bump

Formation method for conductive bump

US Patent 7041590 · Granted May 9, 2006

Estimated economic value: $287,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Manufacturing method for manufacturing a package structure2024
Self-cleaning negative-pressure ejector2024
Electronic device package and method of manufacturing the same2024
Long-effect self-cleaning negative-pressure ejector2023
Electronic device package and method of manufacturing the same2023
Vital signs detecting device and a method for detecting vital signs2020
Fabrication method of a wafer structure2009
Method for forming bump protective collars on a bumped wafer2009
Structure of bumps forming on an under metallurgy layer and method for making th2008
Etchant and method for forming bumps2008
Bumping process2007
Chip packaging structure having redistribution layer with recess2007