Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Temperature optimization of a physical vapor deposition process to prevent extrusion into openings

Temperature optimization of a physical vapor deposition process to prevent extrusion into openings

US Patent 7033931 · Granted Apr 25, 2006

Estimated economic value: $3,956,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Dynamic vacuum seal system for physical vapor deposition sputter applications2025
Surface acoustic wave (SAW) device with antireflective structure2021
Optimized textured surfaces and methods of optimizing2020
Integrated circuit product having a through-substrate-via (TSV) and a metallizat2019
Methods of forming a through-substrate-via (TSV) and a metallization layer after2018
Modulated deposition process for stress control in thick TiN films2013
Modulated deposition process for stress control in thick TiN films2013
High coupling, low loss saw filter and associated method2013
Multiple electrode layer backend stacked capacitor2013
Capacitor contact formed concurrently with bond pad metallization2013
Modulated deposition process for stress control in thick TiN films2012
Temperature compensated surface acoustic wave device and method having buried in2011