Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Methods forming an integrated circuit package with a split cavity wall

Methods forming an integrated circuit package with a split cavity wall

US Patent 7020958 · Granted Apr 4, 2006

Estimated economic value: $11,898,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Three-dimensional printer frame2023
Multi-filament three-dimensional printing2023
Spool for filament of a three-dimensional printer2020
Spool for filament of a three-dimensional printer2020
Extruder for a three-dimensional printer2020
Three-Dimensional printer frame2020
Three-dimensional surface texturing2018
Functional pathway configuration at a system/IC interface2006
Programmable identification in a communications controller2004
Split cavity wall plating for an integrated circuit package2000
Split cavity wall plating for an integrated circuit package2000
Integrated circuit package with a heat spreader coupled to a pair of electrical 1999