Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Packaging and passive alignment of microlens and molded receptacle

Packaging and passive alignment of microlens and molded receptacle

US Patent 6999494 · Granted Feb 14, 2006

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Thin smart card module having strap on carrier2012
Planar and wafer level packaging of semiconductor lasers and photo detectors for2005
Method and structure for heatspreader attachment in high thermal performance IC 2002
Apparatus for dispensing fluid in an array pattern1999
Apparatus for dispensing fluid in an array pattern1998
IC packaging lead frame for reducing chip stress and deformation1998