Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Inverted microvia structure and method of manufacture

Inverted microvia structure and method of manufacture

US Patent 6972382 · Granted Dec 6, 2005

Estimated economic value: $18,903,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Multilayer circuit board with embedded components and method of manufacture2009
Multilayer circuit board with embedded components and method of manufacture2009
Multilayer circuit board with embedded components and method of manufacture2007
Multilayer circuit board with embedded components and method of manufacture2007
Method and apparatus for solder-less attachment of an electronic device to a tex2006
Method and apparatus for solder-less attachment of an electronic device to a tex2006
Circuit board with embedded components and method of manufacture2005
Augmented circuitry integration for a printed circuit board2002
Method and assembly for mounting an electronic device having an optically erasab1996
Assembly for mounting an electronic device having an optically erasable surface1995
Electronic component assembly1992