Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Fabrication of embedded vertical spiral inductor for multichip module (MCM) package

Fabrication of embedded vertical spiral inductor for multichip module (MCM) package

US Patent 6972081 · Granted Dec 6, 2005

Estimated economic value: $4,778,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Toner dispensing system and method for controlling the same2010
Metal alloy 42 liquid level control/aperture plate for acoustic ink printing pri2005
Copper interconnect by immersion/electroless plating in dual damascene process2004
Estimation of toner usage2004
Solid BI-layer structures for use with high viscosity inks in acoustic ink in ac2003
Ballistic aerosol marking apparatus with stacked electrode structure2002
Solid bi-layer structures for use with high viscosity inks in acoustic ink print2002
Electro-static particulate source, circulation, and valving system for ballistic2001
Particulate source, circulation, and valving system for ballistic aerosol markin2001
Particulate marking material transport apparatus utilizing traveling electrostat2001
Inorganic overcoat for particulate transport electrode grid2001
Organic overcoat for electrode grid2001