Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Multilayer printed board with a double plane spiral interconnection structure

Multilayer printed board with a double plane spiral interconnection structure

US Patent 6963034 · Granted Nov 8, 2005

Estimated economic value: $42,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Probe for electric/magnetic field2015
Electromagnetic field measuring apparatus, electromagnetic field measuring metho2015
Infrared ray sensor, infrared ray detection device, and electronic apparatus2014
Electromagnetic field measurement apparatus2014
Electric field/magnetic field sensors and methods of fabricating the same2013
Transmission line filter2013
Electric field sensor, magnetic field sensor, electromagnetic field sensor and e2012
Electric field sensor and method for fabricating the same2012
Magnetic field measuring apparatus capable of measuring at high spatial resoluti2008
Interlayer structure with multiple insulative layers with different frequency ch2003
Printed circuit board with multiple insulative magnetic layers2002
Multilayer printed board with a double plane spiral interconnection structure2002