Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Evaluating pattern for measuring an erosion of a semiconductor wafer polished by a chemical mechanical polishing

Evaluating pattern for measuring an erosion of a semiconductor wafer polished by a chemical mechanical polishing

US Patent 6922070 · Granted Jul 26, 2005

Estimated economic value: $1,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Semiconductor device2010
Method for manufacturing semiconductor device2009
Fluorine-containing compounds, fluorine-containing polymerizable monomers, fluor2007
Evaluating pattern for measuring an erosion of a semiconductor wafer polished by2004
Evaluating pattern for measuring an erosion of a semiconductor wafer polished by2002
Wiring structure for semiconductor device2001
Reagents for labeling SH groups, process for the preparation of them and method 2001
Al/Ti layered interconnection and method of forming same1999
Method for detecting blood component using conidiobolus hemagglutinin1998
Method for synthesizing aromatic polymers1996
Fluorine-containing curable resin composition and use thereof1994
Novel gamma-butyrolactone derivatives1989