Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Manufacturing method for sealing a semiconductor device

Manufacturing method for sealing a semiconductor device

US Patent 6919218 · Granted Jul 19, 2005

Estimated economic value: $108,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Teaching device and teaching method2021
Estimation of shift and small image distortion2017
Camera module and mobile terminal unit2013
Camera module and mobile terminal unit2013
Camera module having circuit component2012
Camera module2009
Camera module2009
Sealing structure for mounting a semiconductor device to a substrate2009
Sealing structure for mounting a semiconductor device to a substrate2009
Flexible substrate and a connection method thereof that can achieve reliable con2008
Image down-loading apparatus and system, and image down-loading method2007
Image pickup module, method of manufacturing the same, and spacer with infrared 2007