Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Alignment structure and method for mating a wafer delivery device to a wafer treatment tool

Alignment structure and method for mating a wafer delivery device to a wafer treatment tool

US Patent 6914251 · Granted Jul 5, 2005

Estimated economic value: $8,052,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Apparatus for vertical screening2025
Power coupling device2025
Scanning systems with dynamically adjustable shielding systems and related metho2023
Power coupling device2023
Wheel and lift unit for radiation imaging modalities2022
System and method for sampling frequency adjustment for radiation imaging system2022
Scanning systems with dynamically adjustable shielding systems and related metho2021
Adjustable guide wheel for axial positioning of a rotatable gantry of an imaging2020
Power generation for radiation system2019
X-ray inspection system X-ray radiation shielding curtains2019
Adjustable circumference electrostatic clamp2019
Multiple diameter in-vacuum wafer handling2018