Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method and apparatus for coupling a circuit board to a transmission line that includes a heat sensitive dielectric

Method and apparatus for coupling a circuit board to a transmission line that includes a heat sensitive dielectric

US Patent 6909051 · Granted Jun 21, 2005

Estimated economic value: $6,899,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Method of fabricating a component material for a battery cell2025
Composition, methods for its production, and its use2025
Special purpose modes in photonic band gap fibers2013
Method for coupling a circuit board to a transmission line that includes a heat 2002
Single cable, single point, stimulus and response probing system and method2002
Method for fabricating an overcoated printed circuit board with contaminant-free2000
System and method for the injection and cancellation of a bias voltage in an att1999
Method for detecting open circuits with a measurement device1999
Spark gap for overcoated printed circuit boards1999
System for detecting open circuits with a measurement device1999
Low power high efficiency power supply1999
Hand-held test instrument1998