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Home › Method of manufacturing a resin molded or encapsulation for small outline non-leaded (SON) or quad flat non-leaded (QFN) package

Method of manufacturing a resin molded or encapsulation for small outline non-leaded (SON) or quad flat non-leaded (QFN) package

US Patent 6897093 · Granted May 24, 2005

Estimated economic value: $73,000 ⓘ

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