{"@context": "https://schema.org", "@type": "BreadcrumbList", "itemListElement": [{"@type": "ListItem", "position": 1, "name": "Home", "item": "https://www.patentleaderboard.com/"}, {"@type": "ListItem", "position": 2, "name": "Method for forming interconnections including multi-layer metal film stack for improving corrosion and heat resistances", "item": "https://www.patentleaderboard.com/patent/6872603"}]}
Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method for forming interconnections including multi-layer metal film stack for improving corrosion and heat resistances

Method for forming interconnections including multi-layer metal film stack for improving corrosion and heat resistances

US Patent 6872603 · Granted Mar 29, 2005

Estimated economic value: $33,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Method of manufacturing core sheet including insulation coating removing step2024
Grease composition2023
Rotary electrical machine with stator core having powder bodies within holes2023
Double-sided tape and display device including the same2022
Electromagnetic valve2022
Steering device2021
Image processing apparatus, image processing method, camera apparatus, remote co2021
Method for manufacturing core plate2020
Airbag for blood pressure measuring device and method of manufacturing the same2018
Hydraulic pressure control apparatus2014
Liquid crystal display having transparent conductive film on interlayer insulati2013
Normally-open solenoid valve including plunger formed with pressure receiving po2013