Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method of fabricating an electronic component

Method of fabricating an electronic component

US Patent 6872594 · Granted Mar 29, 2005

Estimated economic value: $51,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Semiconductor component comprising an interposer substrate2014
Electronic component with semiconductor chips, electronic assembly composed of s2013
Integrated circuit and method for producing the same2012
Semiconductor device comprising a housing and a semiconductor chip partly embedd2010
Placement system for populating a substrate with electronic components2009
Semiconductor device with a rewiring level and method for producing the same2008
Electronic component with semiconductor chips, electronic assembly composed of s2008
Electronic component with multilayered rewiring plate and method for producing t2007
Self-supporting connecting element for a semiconductor chip2007
Protective device for subassemblies and method for producing a protective device2007
Method for manufacturing a stack arrangement of a memory module2007
Method for populating a substrate with electronic components2006