Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method of reducing particulate contamination during polishing of a wafer

Method of reducing particulate contamination during polishing of a wafer

US Patent 6849548 · Granted Feb 1, 2005

Estimated economic value: $653,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Containerised LNG liquefaction unit and associated method of producing LNG2024
Process for making lactose-free milk powders2022
Use of H.sub.2 O.sub.2 solution as a method of post lap cleaning2000