Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › System and method for detecting location of a defective electrical connection within an integrated circuit

System and method for detecting location of a defective electrical connection within an integrated circuit

US Patent 6842021 · Granted Jan 11, 2005

Estimated economic value: $19,317,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Method of reducing the time required to perform a passive voltage contrast test2010
Built-in design edit structures2008
Method of parallel lapping a semiconductor die2008
Method of editing a semiconductor die2008
De-packaging process for small outline transistor packages2007
Process for forming and analyzing stacked die2007
Method for non-destructive removal of cured epoxy from wafer backside2007
Method of debugging a 3D packaged IC2006
Semiconductor die with an editing structure2006
E-beam voltage potential circuit performance library2005
Non-destructive method of measuring the thickness of a semiconductor wafer2005
Method of testing the electrostatic discharge performance of an IC device2004