Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method for manufacturing a multi-layer printed circuit board

Method for manufacturing a multi-layer printed circuit board

US Patent 6839964 · Granted Jan 11, 2005

Estimated economic value: $8,612,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

3D electrical integration using component carrier edge connections to a 2D conta2023
Method of designing an application specific probe card test system2013
Self-referencing voltage regulator2012
Sharing resources in a system for testing semiconductor devices2010
Sawing tile corners on probe card substrates2010
Method and apparatus for switching tester resources2010
Intelligent probe card architecture2007
Probe head arrays2007
Probe card assembly including a programmable device to selectively route signals2007
High performance probe system2005
PC board having clustered blind vias2004
Circuit for testing the operation of a semiconductor device1999