Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method for fabricating semiconductor component with an optimized thickness

Method for fabricating semiconductor component with an optimized thickness

US Patent 6825110 · Granted Nov 30, 2004

Estimated economic value: $1,560,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Device for replacing roller sets2019
Electric unit for a pumped-storage power plant having components within and outs2017
Connection arrangement for semiconductor power modules2015
Turbine-based energy generation system with DC output2015
Method and device for exchanging roller batteries2013
Power semiconductor2013
IGBT cathode design with improved safe operating area capability2008
Method of manufacturing a semiconductor device having a cathode and an anode fro2004
Power semiconductor module2004
Bipolar transistor with an insulated gate electrode2003
Process for fabricating a semiconductor component2002
Short-circuit-resistant IGBT module2002