Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Semiconductor package with multiple sides having package contacts

Semiconductor package with multiple sides having package contacts

US Patent 6815254 · Granted Nov 9, 2004

Estimated economic value: $5,759,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Stackable molded packages and methods of making the same2011
Digital and RF system and method therefor2009
Digital and RF system and method therefor2009
Digital and RF system and method therefor2009
Method and apparatus for testing a semiconductor structure having top-side and b2007
Method and apparatus for manufacturing an interconnect structure2002
Method and apparatus for stress relief in solder bump formation on a semiconduct2000
Method and apparatus for stress relief in solder bump formation on a semiconduct2000
Bumped semiconductor device having a trench for stress relief1999
Bumped semiconductor device having a trench for stress relief1999
Process for forming a semiconductor device including a capacitor1998
Single metal-plate bypass capacitor1994