Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Bond layer for silicon containing substrate

Bond layer for silicon containing substrate

US Patent 6777093 · Granted Aug 17, 2004

Estimated economic value: $54,781,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

System and method for automated indication confirmation in ultrasonic testing2025
Radio-wave responsive doped nanoparticles for image-guided therapeutics2022
Strong, flexible, and thrombus-free woven nanotextile based vascular grafts, and2021
MRI and CT contrast-enabled composite implants for image-guided tissue regenerat2020
Composite airfoil2019
Systems for quality monitoring of additive manufacturing2019
Nanoparticle formulations for delivering multiple therapeutic agents2018
Electrospinning apparatus and method for producing multi-dimensional structures 2018
Electrospinning apparatus and method for producing multi-dimensional structures 2018
Core-shell particle formulation for delivering multiple therapeutic agents2017
Oxidation resistant coatings, processes for coating articles, and their coated a2017
Nanoparticle formulations for delivering multiple therapeutic agents2017