Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Die attach adhesives with epoxy compound or resin having allyl or vinyl groups

Die attach adhesives with epoxy compound or resin having allyl or vinyl groups

US Patent 6750301 · Granted Jun 15, 2004

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Ultrasound diagnostic apparatus and method for controlling the same2025
Liquid compression molding or encapsulant compositions2025
Thermoset resin composite materials comprising inter-laminar toughening particle2020
Composite materials with high Z-direction electrical conductivity2020
Curable compositions containing benzoxazine epoxy blend and use thereof2019
Composite materials with high Z-direction electrical conductivity2019
Conductive compositions and methods of using them2018
Epoxy-based resin composition for composite materials2018
Methods to control wafer warpage upon compression molding thereof and articles u2018
Adhesive for electronic component2017
Conductive die attach film for large die semiconductor packages and compositions2016
Pre-cut wafer applied underfill film on dicing tape2016