Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Facilitating the spread of encapsulant between surfaces of electronic devices

Facilitating the spread of encapsulant between surfaces of electronic devices

US Patent 6743069 · Granted Jun 1, 2004

Estimated economic value: $40,563,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Low-cost circuit board materials and processes for area array electrical interco2011
Thermal management in electronic displays2010
Low-cost circuit board materials and processes for area array electrical interco2010
Woven electronic textile, yarn and article2009
Hearing aid with large diaphragm microphone element including a printed circuit 2007
Interconnecting large area display panels2006
Hearing aid with large diaphragm microphone element including a printed circuit 2006
Low-cost circuit board materials and processes for area array electrical interco2005
Thermal management in electronic displays2005
Low-cost circuit board materials and processes for area array electrical interco2005
Making interconnections to a non-flat surface2004
Solid oxide fuel cells and interconnectors2003