Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method of forming a soldered electrical connection

Method of forming a soldered electrical connection

US Patent 6742248 · Granted Jun 1, 2004

Estimated economic value: $15,711,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Media width sensing2018
Media width sensing2018
Media width sensing2018
Systems and methods for thermal control of integrated circuits2017
Fluxless solder attachment of a microelectronic chip to a substrate2002
Method of making lightweight, low thermal expansion microwave structures1999
Fabrication of reliable ceramic preforms for metal matrix composite production1994
Surface treatment method for fatigue-resistant solder1994
Fatigue resistant lead-tin eutectic solder1994
Method and system for removing contaminants1993
Chemical vapor deposition of zinc oxide films and products1988
PIN Amorphous silicon solar cell with nitrogen compensation1985