Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method for relieving bond stress in an under-bond-pad resistor

Method for relieving bond stress in an under-bond-pad resistor

US Patent 6737745 · Granted May 18, 2004

Estimated economic value: $30,392,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Transmission actuator and methods of use and manufacture thereof2016
Front pillar construction having reinforcement member for vehicle frame2015
Vehicle seat assembly2012
Method for placing active circuits beneath active bonding pads2010
Method for placing active circuits beneath active bonding pads2010
Method for placing active circuits beneath active bonding pads2010
Method for placing active circuits beneath active bonding pads2004
Method for placing active circuits beneath active bonding pads2004
Method for placing active circuits beneath active bonding pads2004
Method for relieving bond stress in an under-bond-pad resistor2002
Method for relieving bond stress in an under-bond-pad resistor2002
Method for relieving bond stress in an under-bond-pad resistor2002