Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Semiconductor device having semiconductor element housed in packed with heat sink

Semiconductor device having semiconductor element housed in packed with heat sink

US Patent 6713865 · Granted Mar 30, 2004

Estimated economic value: $48,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Lamp unit and power supply attachment2022
Sensor system, sensor module, and lamp device2022
Optical coupling device, manufacturing method thereof, and power conversion syst2017
Vehicle headlamp2016
Vehicle headlamp and projection lens mounting method2016
Vehicle headlamp2011
Light emitting module and lighting unit2007
MOLDING APPARATUS FOR A REINFORCEMENT RESIN COATING OF GLASS OPTICAL FIBER EXPOS2007
Semiconductor device substrate and method of manufacturing semiconductor device2002
Semiconductor device with long lifetime1998
Thermosetting resin from amine terminated amic acid and bis-maleimide1989
Hydrated chromium oxide-coated steel strip useful for welded cans and other cont1985