Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method of making an electronic product including package-based inductor coupled to integrated circuit

Method of making an electronic product including package-based inductor coupled to integrated circuit

US Patent 6713375 · Granted Mar 30, 2004

Estimated economic value: $1,083,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Vibration dampening for high-density storage system structure2025
High-density storage system structure2025
Obfuscation-enhanced memory encryption2019
Obfuscation-enhanced memory encryption2019
Obfuscation-enhanced memory encryption2018
Converting data signals in a multiple communication protocol system area network2006
Method and apparatus for defining signal timing for an integrated circuit device2003
Power devices in wide bandgap semiconductor2003
Method of making a MOSFET structure having improved source/drain junction perfor2002
Technique to minimize crosstalk in electronic packages2002
High performance chip/package inductor integration2001
High performance flip-chip semiconductor device2001