Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Aluminum-copper bond pad design and method of fabrication

Aluminum-copper bond pad design and method of fabrication

US Patent 6709965 · Granted Mar 23, 2004

Estimated economic value: $6,610,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Sputtering target with reverse erosion profile surface and sputtering system and2015
Guard ring having electrically isolated lightening bars2005
Reinforced aluminum copper bonding pad2004