Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Thermally and mechanically stable low-cost high thermal conductivity structure for single-mode fiber coupling to laser diode

Thermally and mechanically stable low-cost high thermal conductivity structure for single-mode fiber coupling to laser diode

US Patent 6709169 · Granted Mar 23, 2004

Assignee

No assignee recorded.

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Method and system for operating a back-to-back compressor with a side stream2019
Method and equipment for detecting rotating stall and compressor2016
Thermoelectric converter with projecting cell stack2014
Laser system with reduced power fluctuations for employment in applications requ1999
High-thermal-conductivity sealed package for fiber optic coupling to an optoelec1999
Laser system with reduced power fluctuations for employment in applications requ1998
Method for bonding thermally-mismatched elements of a traveling wave tube1996
Traveling wave tube with plate for bonding thermally-mismatched elements1995
Traveling wave tube with thermally-insensitive loss button structure1995