Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method for forming sputter target assemblies

Method for forming sputter target assemblies

US Patent 6708870 · Granted Mar 23, 2004

Estimated economic value: $16,068,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Gold evaporative sources with reduced contaminants and methods for making the sa2018
Gold evaporative sources with reduced contaminants and methods for making the sa2017
Diffusion bonded high purity copper sputtering target assemblies2017
Method for forming sputter target assemblies having a controlled solder thicknes2015
Method for forming sputter target assemblies having a controlled solder thicknes2015
Method for forming sputter target assemblies having a controlled solder thicknes2015
Method for forming sputter target assemblies having a controlled solder thicknes2013
Method for forming sputter target assemblies having a controlled solder thicknes2013
Method for forming sputter target assemblies having a controlled solder thicknes2013
Method for forming sputter target assemblies2012
Method for forming sputter target assemblies2012
Method for forming sputter target assemblies2012