Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Conductor posts, construction for and method of fabricating semiconductor integrated circuit chips using the conductor post, and method of probing semiconductor integrated circuit chips

Conductor posts, construction for and method of fabricating semiconductor integrated circuit chips using the conductor post, and method of probing semiconductor integrated circuit chips

US Patent 6706554 · Granted Mar 16, 2004

Estimated economic value: $2,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Impact extrusion molded article, and impact extrusion molding method, and an imp2006
Aluminum alloy sheet for magnetic disk substrate aluminum alloy clad sheet for m1999
Lightweight V-grooved pulley1994
Zinc-nickel alloy plating solution1989
Process for forming mask patterns of positive type resist material with trimethy1988
Positive type resist material with trimethylsilylnitrile1987
Method for inspecting defects of thin material film1986
Process for forming heat-resistant resin films of polyimide and organosilicic re1985
Method for plating an article and the apparatus therefor1985