Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Semiconductor device having bumps

Semiconductor device having bumps

US Patent 6689679 · Granted Feb 10, 2004

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Sensor module, sensor device, manufacturing method of sensor device, and electro2014
Piezoelectric device and method for manufacturing the same2009
Piezoelectric device and method for manufacturing the same2009
Piezoelectric oscillator, manufacturing method thereof, and electronic device2008
Oscillator2008
Piezoelectric oscillator, manufacturing method therefor, mobile phone apparatus 2007
Oscillator2006
Piezoelectric oscillator, manufacturing method thereof, and electronic device2006
Piezoelectric oscillator, portable telephone unit using piezoelectric oscillator2006
Piezoelectric oscillator, portable phone employing piezoelectric oscillator, and2006
Piezoelectric oscillator, portable telephone using a piezoelectric oscillator, a2005
Wire bonding method, semiconductor device, circuit board, electronic instrument 2002