Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Multi-layer integrated circuit structure with reduced magnetic coupling

Multi-layer integrated circuit structure with reduced magnetic coupling

US Patent 6664606 · Granted Dec 16, 2003

Estimated economic value: $19,998,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Actively tuned filter2012
Tunable filter utilizing a conductive grid2009
Localized enhancement of multilayer substrate thickness for high Q RF components2007
Localized enhancement of multilayer substrate thickness for high Q RF components2005
Multilayer ceramic package transmission line probe2004
Broad band impedance matching device with coupled transmission lines2003
Broad band impedance matching device with reduced line width2003
Integration of a receiver front-end in multilayer ceramic integrated circuit tec2001
Multilayer lowpass filter with single point ground plane configuration1998
Commonly coupled high frequency transmitting/receiving switching module1996