Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › PACKAGING MATERIAL FOR MOLDING MATERIAL AND PARTS FOR SEMICONDUCTOR PRODUCTION APPARATUSES, METHOD FOR PACKAGING BY USING SAME AND PACKAGED MOLDING MATERIAL AND PARTS FOR SEMICONDUCTOR PRODUCTION APPARATUSES

PACKAGING MATERIAL FOR MOLDING MATERIAL AND PARTS FOR SEMICONDUCTOR PRODUCTION APPARATUSES, METHOD FOR PACKAGING BY USING SAME AND PACKAGED MOLDING MATERIAL AND PARTS FOR SEMICONDUCTOR PRODUCTION APPARATUSES

US Patent 6663924 · Granted Dec 16, 2003

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Composition containing fluorine-containing polymer and crosslinked article2025
Fluorine-containing elastomer composition and article2025
Crosslinkable elastomer composition and fluororubber molded article2025
Nitrile oxide compound2025
Silsesquioxane2024
Composition and molded article containing fluorine-containing polymer2024
Iodine-containing compound2024
Polybenzimidazole, precursor polyamide thereof, and method for producing same2024
Composition and molded article2024
Laminate2023
Crosslinkable elastomer composition and fluororubber molded article2023
Polybenzimidazole, precursor polyamide thereof, and method for producing same2023