Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Electrical and physical design integration method and apparatus for providing interconnections on first level ceramic chip carrier packages

Electrical and physical design integration method and apparatus for providing interconnections on first level ceramic chip carrier packages

US Patent 6657130 · Granted Dec 2, 2003

Estimated economic value: $4,756,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Automated histological processing of biological specimens and associated technol2024
Automated slide processing systems, consumable slide processing modules, and rea2024
Automated histological processing of biological specimens and associated technol2023
Automated histological processing of biological specimens and associated technol2020
Automated histological processing of biological specimens and associated technol2019
Extensible definition of interactive system productivity facility (ISPF) panels2017
Mainframe web client2014
Automated audit process2012
Automated audit process2009
In-module current source2006
Method of assembling an interconnect device assembly2006
Method of assembling a land grid array module2004