Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Electrodeposition apparatus for producing electrodeposited copper foil and electrodeposited copper foil produced by the apparatus

Electrodeposition apparatus for producing electrodeposited copper foil and electrodeposited copper foil produced by the apparatus

US Patent 6652725 · Granted Nov 25, 2003

Estimated economic value: $69,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Roughened copper foil, copper-cladded laminate board, and printed wiring board2025
Electrolytic copper foil2025
Electrolytic copper foil2024
Electro-deposited copper foil, surface-treated copper foil using the electro-dep2016
Electro-deposited copper foil, surface-treated copper foil using the electro-dep2016
Electrodeposited copper foil, its manufacturing method, surface-treated electrod2014
Electrodeposited copper foil, its manufacturing method, surface-treated electrod2014
Surface-treated electro-deposited copper foil and method for manufacturing the s2014
Surface-treated electro-deposited copper foil and method for manufacturing the s2014
Method of preparing electrolytic copper solution acidified with sulfuric acid, s2013
Method of preparing electrolytic copper solution acidified with sulfuric acid, s2013
Negative electrode for nonaqueous secondary battery, process of producing the ne2010