Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Methods and electronic board products utilizing endothermic material for filling vias to absorb heat during wave soldering

Methods and electronic board products utilizing endothermic material for filling vias to absorb heat during wave soldering

US Patent 6651869 · Granted Nov 25, 2003

Estimated economic value: $50,228,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Varied ball ball-grid-array (BGA) packages2024
Silicon photonic integrated lens compatible with wafer processing2024
Decoupling layer to reduce underfill stress in semiconductor devices2023
Protective device for electronic device2021
Surface structure method and apparatus associated with compute or electronic com2020
Apparatus and method for conformal coating of integrated circuit packages2019
Electronic wearable device electrode pad with collection well2018
Inclined photonic chip package for integrated optical transceivers and optical t2016
Wireless peripheral data transmission for touchscreen displays2016
Inclined photonic chip package for integrated optical transceivers and optical t2016
Temporal based motion sensor reporting2014
Temporal based motion sensor reporting2013