Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Chemical mechanical polishing apparatus having edge, center and annular zone control of material removal

Chemical mechanical polishing apparatus having edge, center and annular zone control of material removal

US Patent 6641461 · Granted Nov 4, 2003

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Sampling system with a replaceable cassette assembly and methods of using the sa2025
Filtration system for cell removal systems and methods of using the same2025
Polishing head, wafer polishing apparatus using the same, and wafer polishing me2023
Gate height uniformity in semiconductor devices2016
Reduction of oxide recesses for gate height control2016
Vacuum storage method and device for crystalline material2016
Gate height uniformity in semiconductor devices2015
Removal of nitride bump in opening replacement gate structure2015
Reduction of oxide recesses for gate height control2014
Vertically adjustable chemical mechanical polishing head and method for use ther2008
Vertically adjustable chemical mechanical polishing head and method for use ther2008
Apparatus and method for chemical-mechanical polishing (CMP) head having direct 2007