Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method and apparatus for in-situ monitoring of thickness during chemical-mechanical polishing

Method and apparatus for in-situ monitoring of thickness during chemical-mechanical polishing

US Patent 6621584 · Granted Sep 16, 2003

Estimated economic value: $7,681,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Subpixel light emitting diodes for direct view display and methods of making the2025
Light-emitting diode device containing microlenses and method of making the same2024
Semiconductor device containing stress relaxation layer and method of making the2024
Subpixel light emitting diodes for direct view display and methods of making the2024
Data platform and analytics for predicting media metrics2020
Method for electronic circuit assembly on a paper substrate2016
Method and apparatus for electrochemical planarization of a workpiece2012
Diffraction grating in conjunction with reduced thickness to increase efficiency2011
Orbiting indexable belt polishing station for chemical mechanical polishing2007
Apparatus for electrochemically depositing a material onto a workpiece surface2006
Method and apparatus for the electrochemical deposition and removal of a materia2006
Method and apparatus for electrochemical planarization of a workpiece2005